Xizhi District, New Taipei City, 22175, TAIWAN (R.O.C.)
CHIP: SN75DP130, PORT: 1 DP, INTERFACE: DP, DIMENSIONS: 50mm x 40mm (1.97" x 1.57"), Module Boards
Module Boards EXT-DP Characteristics:
CHIP: Re-Driver SN75DP130
Features: Supports DP v1.1a and DP v1.2 signaling including HBR Data
rates to 2.7Gbps
REAR PANEL I/O PORTS: 1 DP port, I/O CONNECTORS, 1 DP connector, 1 LCD/Inverter power connector
APPLIED MODEL: HU171/173, HU101/103, HM100/101/103-QM87/HM86
TEMPERATURE:
Operating: 0°C to 60°C
Storage: -20°C to 85°C
HUMIDITY: 5% to 90%
DIMENSIONS: 50mm x 40mm (1.97" x 1.57")
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
Please fill the all required fields....!!
