Xizhi District, New Taipei City, 22175, TAIWAN (R.O.C.)
Intel® Xeon® Modular-Designed System, Supports DDR3 SODIMM up to 16GB, 2x 2.5" SATA drive bays, 5 expansion slots: 2 PCIe x16, 1 PCIe x4, 2 PCI, 1 Vertical USB for securing data from unauthorized access, 7-Year CPU Life Cycle Support
High-Performance Embedded System EC553-DL Characteristics:
Chipset Intel® C226 Express Chipset
Memory Two 204-pin SODIMM up to 16GB
Dual Channel DDR3 1333/1600MHz
Controller Intel® HD Graphics
External/Internal 2 x 2.5" SATA 3.0 Drive Bays
Indicators 1 x Status LED
1 x HDD LED
USB 2 x USB 3.0 (type A)
4 x USB 2.0 (type A)
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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