Robert-Bosch-Str. 32-36, 72250 Freudenstadt, Germany
Features
An OSP (Organic Surface Preservative) anti-oxidation layer with a thickness of 0.2 µm – 0.5 µm is applied to the surface of the bare copper. This layer enhances the soldering characteristics on the copper pad and in the drilled holes. The OSP pre-treated end surface guarantees a perfect basis for various, lead-free soldering processes while maintaining the thermal stability.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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