Robert-Bosch-Str. 32-36, 72250 Freudenstadt, Germany
Features
With the electroless copper process the PCB normally passes through a total of five process steps to obtain the desired coating thickness of 0.5 µm and more. Depending on the individual process an accelerator level can be integrated if necessary. For an optimum copper deposition in the bore hole maintenance-free fluid jet systems are applied.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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