Robert-Bosch-Str. 32-36, 72250 Freudenstadt, Germany
Features
The panel measuring table offers a quick determination of the etching distribution after differential etching processes or the plating build-up of copper surfaces. The measurements are carried out fully automatically by a resistive sensor after entering the input parameters.
Subsequently, the measuring points are evaluated by a PC and converted into a 3D diagram, statistics tool included.
Specifications
Dimensions: 1200 x 1120 x 1210 mm (L x W x H)
Weight: 200 kg
Maximum panel size: 650 x 650 mm
Measuring range:
copper thicknesses 1 µm – 120 µm
Measuring tolerances:
0.1 µm – 10 µm
Cu layer 0.1 µm – 5 µm: ± 0.075 µm
Cu layer 5 µm – 10 µm: ±
5 µm – 120 µm
Cu layer 5 µm – 50 µm: ± 0.5 µm
Cu layer 50 µm – 80 µm: ±
Cu layer 80 µm – 120 µm: ±
Parameter Input:
Data Output
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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