Robert-Bosch-Str. 32-36, 72250 Freudenstadt, Germany
Features
Immersion Tin is the lead-free alternative to the Hot Air Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer protects untreated copper from oxidation; it is a perfect foundation for soldering applications, as well as for plug contacts.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
Please fill the all required fields....!!