HOTOPRINT Elektronik GmbH & Co. KG

Electroplating

During the galvanic process, copper is deposited on the conductor tracks, copper surfaces and in the vias by electrolysis . The thickness of the copper plating is regulated according to customer specifications. In general, an outer copper of 40-50 µm or 105 µm and a copper plating of the bore of 25 µm are aimed for.Afterwards, pure tin is electrolytically deposited on the coppered surfaces and bores in our electroplating machine . The tin serves as an etching resist and covers the coppered surfaces in the later etching process.