HOTOPRINT Elektronik GmbH & Co. KG

Press multilayer

In previous processes, the inner layers were structured with a layout and checked by the AOI. The controlled inner layers are pressed with resin-containing glass fiber mats - prepregs and copper foils to form multi-layer circuits. The layer structure is different for each type of multilayer individually. Example of layer structure 4-layer ML For pressing, the inner layers are mounted on the pressing tool according to the respective structure plan with pressure equalization pads, prepregs and copper foils. This press pack is pressed under high pressure and heat in HML vacuum presses. The pressing parameters during the process