AOI INLINE INSPECTION TOP AND BOTTOM
The AOI Mek PowerSpector BTL system offers inspection of the bottom and top of PCBs after reflow, wave or selective soldering and placement of THT and SMT components.
With 9 cameras (18 in total), this system is designed to inspect PCBs transported by pallet in handling systems, with a combined weight of up to 5Kg, as well as the inspection of PCBs transported without a pallet. The PowerSpector 550BTL accepts PCBs with a maximum dimension of up to 550x550 mm (21.6”). The PowerSpector 350BTL is designed for medium sized PCBs up to 350x250mm (13.8 ″ x9.8 ″).
BOTTOM inspection with 9 cameras
The GTAz inspection head on the BOTTOM side has a tolerance of 30 mm from the PCB surface. An additional Z axis allows the head to be adjusted an additional 30mm to allow optimal flexibility for inspection within the pallets and correct adjustment of angle cameras. The 18.75u resolution of the main optics and the 13u resolution of the angle chambers also offer a 01005” (0402 mm) SMD inspection option, including height verification of objects such as pins and packages, as well as chip height measurement 3D.
TOP inspection with 9 cameras, 60 mm clearance and 30 mm Z axis
The GDAz inspection head on the TOP side was specially developed to combine a 60 mm tolerance with full inspection of the weld meniscus via the 3D meniscus profiler. An additional 30mm Z axis, with auto focus option, allows viewing of the top of taller components. Angle cameras with 20u resolution can be used to inspect side markings on components as well as verify accurate insertion using height verification.
