OSAI ASSpA

Power Devices Packaging

Power Devices Packaging

Easy Mass Production

As an automation company, OSAI can offer many solutions for the automatic assembly of power modules.From simple master boards to final testing, OSAI's expertise in semiconductor application automation can make mass production easy and 100% human error free.

MAIN CHARACTERISTICS

• Laser scoring for ceramic substrate
• Laser markingfor ceramic substrate
• Splitting machinesfor ceramic substrate
• Induction pin soldering (patented) or automatic pin insertion
• Assembling, gluing, screwing and UV curing plastic container
• Vacuum encapsulation silicone gel