Molex

Molex

2222 Wellington Court Lisle, IL 60532 USA

MicroElectronics Assembly

MicroElectronics Assembly

MicroElectronics Assembly

Assembly of bare die and components on various substrates or PCBs

  • State-of-the-art bare die placementto accuracy of ± 10µm
  • Mixed assembly (SMT + Bare Die)
  • Wire bonding equipment
  • Flip chip with solder bump or Cu pillar
  • Pitch down to 50 microns
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