Logitech LTD bonding jigs allow sample materials to be fixed to a substrate such as microscopic slide for production of thin and ultra-thin sections.
The production of thin and ultra-thin sections of materials required that the sample material be fixed to a substrate, such as a microscope slide. It is important that the orientation of the sample-bond-substrate is controlled for achieving optimal sample thickness control and parallelism.
“zero bonding” and “controlled thickness bonding” are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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