Logitech Limited

LP70 Multi-station Lapping & Polishing System

At Logitech, we have been developing the LP70, an ALL NEW multi-station precision lapping and polishing system. This bench-top machine is designed to run concurrent automated processes, allowing operators to achieve repeatable results to stringent sample specifications. With four workstations as standard, this system is the optimal solution for both production environments and research laboratories.

Each workstation has a wafer process capacity of up 100mm/4″ – the jig speed of each workstation is individually controlled for highly accurate results and the use of driven jig roller arms greatly increases accuracy and repeatability. The LP70 also has the capacity to process samples up to 150mm/6″ in diameter with the use of two PP8 jigs.

Bluetooth capabilities such as automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness, automatically correcting any deviation from the specification set by the operator. Bluetooth also allows for the real-time data collection and feedback from the digital indicator on PP series jigs allowing for greater end-point thickness control for increased accuracy.

Intuitive features with improved functionality allows for increased material removal rates, with greater levels of control and reliable process repeatability.