Tong Hsing Electronic Industries, Ltd.

No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan

Backend Technology & Others - Wafer Grinding & Dicing

Backend Technology & Others - Wafer Grinding & Dicing - Wafer-11. Backend Technology & Others - Wafer Grinding & Dicing (11)

Backend Technology & Others - Wafer Grinding & Dicing (11)

Wafer Grinding & Dicing:

- Grinding: 6", 8", 12" wafers available.

- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.