Tong Hsing Electronic Industries, Ltd.

No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan

Assembly Packaging - GGI Flip Chip

Assembly Packaging - GGI Flip Chip

Assembly Packaging - GGI Flip Chip

GGI Flip Chip (Gold Gold interconnections):

- Maximum die size: 5mm x 5mm

- Maximum number of bumps: 20

- Minimum bump pitch: 150 micons

- Major applications in power LED, SAW, TCXO and MEMS.

substrate manufacturing services-direct bonded copper substrate-dbc

Substrate Manufacturing Services - Direct Bonded Copper Substrate (DBC)

substrate manufacturing services-direct plated copper substrate-dpc

Substrate Manufacturing Services - Direct Plated Copper Substrate (DPC)

assembly packaging-smt

Assembly Packaging - SMT

assembly packaging-c4 flip chip

Assembly Packaging - C4 Flip Chip

backend technology-others-wafer grinding-dicing

Backend Technology & Others - Wafer Grinding & Dicing

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