Tong Hsing Electronic Industries, Ltd.

No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan

Assembly Packaging - C4 Flip Chip

Assembly Packaging - C4 Flip Chip

Assembly Packaging - C4 Flip Chip

C4 Flip Chip (controlled Collapse Chip Connection):

- Eutectic, lead free and high lead solder bumps are available.

- Underfill available.

- Minimun pitch: 200 microns

assembly packaging-ggi flip chip

Assembly Packaging - GGI Flip Chip

substrate manufacturing services-direct bonded copper substrate-dbc

Substrate Manufacturing Services - Direct Bonded Copper Substrate (DBC)

substrate manufacturing services-direct plated copper substrate-dpc

Substrate Manufacturing Services - Direct Plated Copper Substrate (DPC)

assembly packaging-smt

Assembly Packaging - SMT

backend technology-others-wafer grinding-dicing

Backend Technology & Others - Wafer Grinding & Dicing

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