Microelectronics
RF/Microwave Assembly And Test
Innovative technologies require advanced capabilities. When it comes to sophisticated board designs that include microelectromechanical systems (MEMs), sensors, or connectivity we're here to support products from prototype through to production. In addition to traditional electronics assembly techniques, Naprotek offers comprehensive microelectronics design and manufacturing services for custom, high performance, and high reliability applications. We have an extensive suite of in-house microelectronics capabilities including:
Die attach utilizing conductive and non-conductive epoxies
Eutectic die attach with solder preform and Si eutectic scrub
Gold and aluminum wire bonding: wedge and ball
Gold ribbon bonding: thermo compression wedge and gap welding
Sealing: epoxy encapsulation and hermetic solder / weld
RF Test / Tune
Discrete component packaging, system in package (SIP), integrated module assemblies (IMA), and multi-chip modules (MCM)
For precision assembly, our automatic bonding and die attach equipment is trusted by leading brands when component position, loop height, and spacing are critical to performance. Our state-of-the-art clean room supports products requiring ISO 7 (Class 10,000) and ISO 8 (Class 100,000) specifications.
