Manufacturing
Built For Quality, Velocity, And High-Mix PCBA Manufacturing
Naprotek combines value-added engineering and sophisticated electronics manufacturing techniques to realize our customers' complex designs. Leveraging surface mount technology (SMT), microelectronics, ball grid array (BGA) placements, and through-hole assembly processes, we support a variety of printed circuit boards (PCB) configurations including:
Rigid, flex, and hybrid configurations
Large form factors up to 20 in x 24 in
Precision placements down to 0.01005 μm
Fine pitch (0.35 mm) components
We also employ hybrid processes such as lead-free, tin-lead, pin through-hole, wave, and selective solder for advanced board designs. Our recent expansion in manufacturing services includes advanced radiofrequency (RF) and microwave products and assembly, MIL-STD performance testing, and foundry services ideal for thin-film circuits.
