Manufacturing Integration Technology Ltd

Blk 5004 Ang Mo Kio Avenue 5, TECHplace II, #03-12, Singapore 569872

DIE BONDERS FC-1210

Machine Features

» SUPH up to 5,500

» Die Size 0.5-6mm (6-20mm option)

» Bond Force Sensor

» Accuracy ±3µm local ±5µm global

» Face-up/Face-down; BH/Chunk Table Heating; Dipping