Manufacturing Integration Technology Ltd

Blk 5004 Ang Mo Kio Avenue 5, TECHplace II, #03-12, Singapore 569872

DIE BONDERS FC-1250

Machine Features

» SUPH up to 15,000

» Die size 0.3x8mm

» BH Force 0.5-10N

» Accuracy ±10µm

» Face-down; Dipping