Automatic Wafer Transfer BPCx25P5
Features & Benefits
• Horizon Back-to-Back Pitch Changer (BPC) Wafer Transfer Machine transfers 25 wafers in a back-to-back configuration between a 25-slot PB carrier and one 25 slot quartz boat.
• The machine may be configured to accommodate a large diversity of Plastic, Teflon®, metal, Quartz, Silicon Carbide and Polysilicon carriers.
• PLC controlled enhancing system simplicity.
• With the push of a button, the machine transfers wafers safely and automatically.
• The Horizon Series V machines are designed to limit particle contamination by using rodless cylinders, “clean room grade” rails and bearings and electrical boat sensors.
• The machine will not introduce more than 1.5 particles, greater than .23 micron in diameter, per wafer per transfer (machine must be exhausted to achieve this figure).
• Cassette and boat sensors located in the platform prevent the machine from operating if the required carriers are not present.
• All aluminum parts are hard black anodized for corrosion resistance.
• Electrical micro-switch sensors are used to detect retainer position to prevent accidental double loading and scratches.
• Lift system uses ramped speed controls for gentle pick-up and landing.
