Kubatronik Leiterplatten GmbH

Kubatronik Leiterplatten GmbH

Karl-Benz-Straße 13 D-73312 Geislingen / Steige

Technology and capabilities

Technology and capabilities

 

  • Flex up to 8 layer
  • Rigidflex up to 32 layer
  • Rigid Multilayer up to 42 layer
  • Max. thickness 5,6mm
  • Line and Space 3mil (75µm)
  • HDI and SBU with Blind / Buried / Stacked / Staggered Vias
  • Mixture BuildUp
  • Impedance controlled (including measuring protocol)
  • Laser cutting and drilling
  • Heatsinks
  • Backplanes
  • Embedded Components
  • Cavities
  Technical Specs
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