Kubatronik Leiterplatten GmbH

High Density Interconnect

Technological improvements and advancements have resulted in printed circuit boards (PCBs) increasingly high dense formats with steadily improved performance.

The miniaturization and increase in performance of components and semiconductors inevitably drives the technology of the printed circuit board, which leads to the design of finer structures, high-performance materials and laser-drilled blind / buried micro-via technology.  MicroVias enable the connection from one copper layer to another within a PCB. The resulting smaller pad diameters also generate a higher routing density. This is what we are calling “High Density Interconnect - HDI” and “Sequential Build Up – SBU” technology.

(Micro-) Vias on different levels can be staggered or also stacked (staggered / stacked vias). And can be plugged with copper or epoxy.