Congatec Asia Ltd.

Congatec Asia Ltd.

14F-2, No. 270, Sec 4, Taipei City, TAIWAN

COM Express COM modules / Mini ITX Motherboards

COM Express COM modules / Mini ITX Motherboards

COM Express modules and mini ITX motherboards features multiple generations of the Intel Core processors and the graphic output oriented R-series CPUs from AMD. Multiple form factors i.e. COM Express Compact / Basic and Thin Mini-ITX are supported.


The conga TC175 Computer-on-Modules (COMs) with Gen7 Intel® Core™ processor features the greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory.


The conga-IC175, a thin industrial-grade motherboard family, is designed for IoT connected devices. It ships with 4 different dual-core variants of 7th Gen Intel® Core™ U SoC processors and have a configurable cTDP from 7.5 W to 25 W. Two SO-DIMM sockets support up to 32GB DDR4-2133 memory.


The conga-TC170 modules, with COM Express Type 6 pinout, are equipped with the ULV-SoC editions of the sixth generation Intel Core i3/i5/i7 processors. For the first time, they offer a configurable TDP (Thermal Design Power) of 7.5 to 15 watts, which simplifies matching the application to the system’s thermal design.

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