Multilayer 6 layer laser via and UBGA
Application: MedicalTechnology: Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filledMaterial: FR4 High TG with filler Nelco N4000-29Finishing: Blue solder mask and Enig
Sincerely Plantautomation Technology
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Client Success Team (CRM),
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