AUREL S.P.A

ALS200 CO2 Laser System

ALS200 CO2 Laser System

• Aurel ALS200 CO2 Laser System is designed for high accuracy scribing, drilling and cutting of ceramics substrates for thin and thick film hybrid circuits up to 6″ x 6″ (typical Al2O3 and AIN).
• The System is equipped with double nozzle (automatic switching): one for cutting and one for scribing.
• ALS200 lasers are offered as basic system or with optional handling modules from/to stack or cassette magazine for high volume production.

APPLICATIONS

Some applications for electronic and general industrial purposes are:

• 
  Cutting
  Cutting of ceramic substrates
• 
  Scribing
  Scribing of ceramic substrates
   
• Drilling
  Drilling of ceramic substrates

CONTROL SYSTEMS

• The machine is PC controlled and allows a great deal of flexibility on all functions
• Windows © Operating System
• Wide screen monitor and industrial keyboard
• Menù program for cutting, drilling and scribing (linear and circular interpolation)
• Machine diagnostic
• Machine hood & lifting and locking safety switches
• Work recipes storing and data logging

HEAD

• One fixed head with double nozzle
• Motorized focus to adjust the Z-axis according to the substrate thickness
• High resolution Camera for work area vision with crosshair for manual alignment of the substrates

LASER SOURCE

• High power semisealed CO Laser 350-1000W type 2 RF333
• Gas CO plasma tubesmounted on a frame with a 2 granite plane to ensure high output power stability
• RF excitement technology, high peak power, high frequency modulation, compactness
• Factory service free with easy gas cartridge replacement
• Frequency and pulse width programmable and real-time controlled by the electronic control

OTHER OPTIONS

• PRS Vision System for automatic substrate alignment
• Water chiller (stand alone)
• Exhaust aspiration and filtering
• Automatic loading/unloading system from magazine for substrate up to 6”x6”, two stack magazines, one for loading, one for unloading