UltraFLEXplus
UltraFLEXplus
The World’s Leading SoC Device Test Platform
The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP and highly rated IG-XL software developed over the UltraFLEX’s 15 year history .
Advantages
Fastest Time to Production
IG-XL software compatibility and the new Broadside Applications Interface enables test engineers to be more productive from the start and reduce the time to production by more than 20%.
Highest Throughput
The new UltraFLEXplus architecture increases site counts and improves parallel test efficiency, increasing overall throughput and reducing the number of test cells required by 15%-50%.
Scalable Architecture
The UltraFLEXplus can be redeployed for multiple product lines and upgraded for future product requirements, increasing reuse and extending asset’s useful life.
Applications
- Mobile Application Processor
- Digital Baseband Processors
- High Data rate RF Transceivers
- Mobile Power Management ICs (PMIC)
- MicroProcessors
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and backplane transceivers
- Storage Controllers
- High End Microcontrollers
- Audio and Video Processors
Configurations
The UltraFLEXplus has 3 base systems that allow customers to optimize capital cost, floor space and maximum resource count. All three versions utilize the Broadside DIB for higher density, higher site counts, and simplified routing.
UltraFLEXplus Q2424-slot system
UltraFLEXplus Q1212-slot system
UltraFLEXplus Q66-slot system
