TECHNICAL PLATING, INC.

Tin-Lead Alloy plating

Tin-Lead Alloy plating

Tin/Lead Alloy Electroplating

Tin/Lead Alloy plating is primarily used as a coating on electronic connector components, preventing corrosion, and serving as a base for soldered applications. The deposit is silver in color and ranges from matte to bright, depending on the process used. TPI offers matte 60/40 Tin/Lead, matte 90/10 Tin/Lead, and matte 5/95 Tin/Lead  with rack and barrel plating processes, and can certify to the following Specifications:

• MIL-P-81728
• AMS-P-81728
• Custom OEM Specifications

Tin/Lead Solder Dipping

Technical Plating is also one of a select few companies in the United States to perform Hot Solder Dip. Hot Solder Dip is the process of immersing a part into a bath of a molten 60/40-tin/lead alloy at a temperature greater than at 370°F. The coating that's produced consists of a very thin intermetallic layer that first forms at the interface of the base material and the tin, followed by a layer of pure solder. Advantages of Hot Solder Dip is excellent solderability, and excellent wear and corrosion resistance. TPI is able to do Hot Solder Dip as a rack process, and can certify to the following Specifications:

• ASTM A1074-11
• Custom OEM Specifications