Singulus Technologies AG

Multi-Target-Module

Multi-Target-Module (MTM) with 10 DC/RF Cathodes

Sputtering and Process Modules for Semiconductor and Magnetics – Features:

• DC/RF magnetron
• All sputter deposition modes selectable by recipe for all 10 cathodes
• LDD technology
• RF bias option
• Ultra-high vacuum technology, base pressure
• 8*10-9 Torr
• Wafer heating and cooling (options)

Multiple film stack deposition, without the need to break ultra-high vacuum, is one of the key advantages of the MTM process module. Additional features such as wafer heating for hot substrate deposition (option) or a collinear Aligning Magnetic Field (AMF) are available. The AMF can be activated to align the magnetic easy axis during deposition of  ferromagnetic films. The Linear Dynamic Deposition (LDD) technology enables the capability to deposit wedge films with a different film thickness across the wafer and to deposit alloy films with adjustable concentration gradients across one wafer. Both features allow a very cost effective development of film stacks and accelerate the devices development.