Lorom Cable & System Design

Lorom Cable & System Design

168, GaoXin Road, XiaoShan, Hangzhou, Zhejiang, 311200, China

QSFP+

QSFP+

QSFP+

Quad Small Form Factor Pluggable Plus – 40 Gbps Interconnect System

Transmission speeds are continuing to rise as consumers demand ever higher performance from a variety of communications devices. New trends, based computing, where there is a need for seamless access to large data centers are driving significant growth in bandwidth requirements.

LOROM’s unique offering of precision external QSFP+ cable assembly solutions provides a complete product platform addressing and providing unique value propositions to these difficult challenges. The QSFP+ cable assembly product platform provides a cost-effective, high-speed solution that meets and exceeds the bandwidth requirements of current and future applications in servers and external storage systems.

This unique product offering exceeds the performance requirements specified to SFF-8436, 10 G Ethernet IEEE 802.3ba, Fibre Channel, InfiniBand QDR, SAS and SONET/SDH standards with different data rate options.

LOROM QSFP+ cable assemblies comprise the use of unique world-class, state-of-the-art , in-house developed E-MAXX® bulk cable, providing the highest level of signal integrity performance.

In particular, extremely low-insertion loss due to our unique skin-foam-skin, gas-injected dielectric technology as well as extreme control of balanced/unbalanced (Mode conversion), providing significant performance advantages in increased system head-room/budget, as well as ease of cable management and smaller packaging densities.

The cable assemblies employ new innovative PCB technology designed specifically to address the complex issues of optimising signal integrity performance. In particular, cross talk as well as launch condition between wire and PCB termination to optimise return loss and prevent/minimize “ringing” effects.

Our highly automated, controlled cable assembly manufacturing processes using the world’s first automatic soldering process, optimises the critical termination between wire and PCB, improving overall performance and removing the human element.

Automated final-test and quality systems assure high-quality cable assemblies, conforming to the high-speed electrical performance requirements in industry specifications. Excellence of mechanical design exceeds the stringent mechanical interface requirements as defined by applicable industry standards.

Features and Benefits

Applications

  • Data Servers
  • Networked Storage Systems
  • Routers
  • External Storage Systems
  • High Performance Computing (HPC) Applications, Data Centre Networking
  • Communications Switches
  • Industry Standards Infiniband Trade Association (IBTA)
  • IEEE802.3ba 40 Gigabit Ethernet (40g BASE – CR4)

Mechanical Advantages

  • Smallest die-cast backshell in the market
  • Suypports “belly-to-belly” configurations
  • Positive latching mechanism
  • Robust cable strain-relief system isolates cable termination from mechanical stress
  • Reduced backshell protrusion provides short cable exit
  • Choice of boss stub implementation
  • Choice of screws or rivets

Signal Integrity

  • Paddle-card design utilising proprietary board material, provides class insertion loss
  • Paddle-card optimised for best-in-class PSNEXT (Crosstalk)
  • Signal integrity and mechanical performance
  • Controlled wire management and termination process assures consistent high-speed electrical performance
  • Active equalised options with CDR, up to 15 m cable length
  • Excellent EMI shielding performance due to die-cast shell design and 360° cable shielding
  • EEPROM for cable signature & system communications
  • ILD (Insertion Loss Deviation) and ICN (Integrated Crosstalk Noise)

Product Enquiry

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