Kurtz Ersa Automation GmbH

Versaprint 2 Ultra 3

Versaprint 2 Ultra 3

World's first stencil printer with integrated 3D inspection

The latest measuring technology of the 3D-LIST camera is used in the ULTRA³ model. The shape of the smallest solder paste deposits plays a big role in the printed volume and ultimately the shape of the solder joint. Is the paste depot the same height over the entire surface or does it drop off towards the edges? This question is answered by the ULTRA³, which combines a stencil printer and 3D SPI at the same time.

Advantages of ULTRA³ compared to 3D SPI standalone

• 3D SPI to inspect complex boards directly after the printing process
• Detect errors through stencil inspection before they occur
• Zero point measurement of the unprinted LP at any time before printing
• Integrated closed-loop function for print offset
• Consistent software platform for printing and inspection
• Servicing and maintenance for one machine, one AP for both processes
• Less space required in the production line