ILFA GmbH

Multilayers

Multilayers

Multilayers have to be the most many ‘sided’ circuit boards. They are made principally from three different materials: copper foil, prepregs and fine copper-clad laminate, but their functions can be totally diverse.

This is dependent on the layer composition of the three materials which can result in a multitude of combination possibilities. These each lead to another operating mode, and depend on the demands and usage of the final product.

Precoplat produces multilayers of up to 24 layers. We offer a variety of different prepregs and cores from which you can select your individual material construction.

In our modern multilayer pressing station the various PCB layers are pressed together precisely under pressure and temperatures of up to 200 C˚, so that even under difficult electrical stress conditions material separation or delamination is impossible. The individual layers are then connected either by means of through-contacts between the two outer layers (vias) from one outer layer to a defined-depth inner layer (blind vias or blind-hole drillings), or only between two inner layers (buried vias).