Heller Industries, Inc

Manual Batch Pressure Curing Oven - PCO 500

Pressure Curing Ovens

Just as we pioneered SMT solder reflow advances… including full convection and efficient nitrogen usage… we are now the first to offer a family of customized pressure curing and reflow ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for both R&D and high volume manufacturing applications. Multiple cleanroom and automation options are available.

Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers.

• Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]
• Chamber Usable Area (mm): 350[L] x 350[W] x 227[H]
• Max Operating Pressure: 12 Bar (174 psi)
• Max Operating Temperature:
• 200⁰ C (Forced Air Convection)
• 350⁰ C (Conduction Plate Option)
• Manual Loading
• External Chiller Option