We know the production trends. We can produce a high-quality HDI board (High Density Interconnect PCB) in an extraordinary time and in top quality.Even in the production of HDI PCBs, we use the most modern technologies such as filling, measured impedance, via-in-pad, RF materials, or production according to the IPC class 3 standard. Lamination 3+N+3, BGA min. 0.4 mm, burried vias, blind vias (0.15 mm drill), aspect ratio 1:1. We use high-tech MDI (Micromirror Digital Imaging) technology for both the motif and the mask.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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