SQ3000 Multi Function for 3D AOI SPI & CMM
SQ3000 Multi-Function for 3D AOI SPI & CMM
The SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) and coordinate measurement (CMM) applications.
Metrology-Grade Accuracy
Attain highly accurate data with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements.
High Speed Inspection
Speed inspection with the MRS sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.
Fast, Smart, Easy-to-use software
Significantly speed attaining coordinate measurements with CyberCMM™ in seconds not hours.
Reduce training efforts and minimize operator interaction with the AOI software’s intuitive interface, multi-touch controls and 3D image visualization tools take ease of use to a whole new level.
Speed programming with AI2 (Autonomous Image Interpretation) to keep it simple – no parameters to adjust or algorithms to tune.
Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.
Improve yields, reduce downtime and reworks costs with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.
Improve yields with full-fledged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools included in CyberReport™. Improve traceability for process verification and yield improvement.
SQ3000 Multi-Function for 3D AOI SPI & CMM
SQ3000 Multi-Function for 3D AOI SPI & CMM
The SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) and coordinate measurement (CMM) applications.
Metrology-Grade Accuracy
Attain highly accurate data with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements.
High Speed Inspection
Speed inspection with the MRS sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.
Fast, Smart, Easy-to-use software
Significantly speed attaining coordinate measurements with CyberCMM™ in seconds not hours.
Reduce training efforts and minimize operator interaction with the AOI software’s intuitive interface, multi-touch controls and 3D image visualization tools take ease of use to a whole new level.
Speed programming with AI2 (Autonomous Image Interpretation) to keep it simple – no parameters to adjust or algorithms to tune.
Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.
Improve yields, reduce downtime and reworks costs with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.
Improve yields with full-fledged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools included in CyberReport™. Improve traceability for process verification and yield improvement.
