InCarrier
InCarrier
Solution for Test-in-Strip
The InCarrier process is based on a strip-like device carrier for single devices that combines the advantages of the singulated device test with the advantages of high parallel strip test. Leveraging the strip like design the InCarrier ensures robust test-handling for even smallest devices and supports high parallel test.
The InCarrier material flow at the test floor remains over all similar to the established standard process. Unlike strip test, the InCarrier test requires no singulation after test. Therefore the final test remains true final test. This way it overcomes the boundaries of strip test and meets the automotive 6 sigma – 0 PPM requirementsHighlights
Combined advantages of singulated Test and Test-in-Strip
High parallel, but singulated (MEMS) testing
Wide range of package/die sizes
WLCSP solution in production
Strip-like device carrier for single device
Robust handling for even smallest devices
Supports WL test and burn-in test
Re-test option for single devices in the same equipment
Key Features
Loading into strip-like device carriers with Cohu loading equipment
Supports standard transportation media of the backend process
Leverages Cohu InStrip for singulated packages
Offers all features of the standard InStrip set-up
Unloading into final packaging media
Full traceability
Flexibility
Input: Wafer, Tube, Tray, Bowl, Detape
Output: T&R, Bulk, Tube, Tray
InCarrier to Manual Loading
Applications
Leaded and leadless devices
Large and smallest package sizes down to 0.8 x 0.8 mm
IC test
MEMS calibration test
WL packages
