CIPSA GROUP

Multilayer-HDI Circuits

MULTILAYER-HDI CIRCUITS

Today's high-density interconnect (HDI) on printed circuit boards can be realized with Sequentially Built Multilayer Printed Circuit Board (SBU) technology.

This technology allows layer pairs to be sequentially added to an inner layer or multi-layer core. A dielectric (pre-preg) together with copper sheets (copper foil) are added to both sides of the inner core and sequentially manufacturing said structure as if it were a normal multilayer, with holes that go through it completely (through hole). or blind and/or buried drills made with depth control or laser drilling go through up to the layer we need (blind/buried vias).

Today CIPSA is prepared to manufacture this SBU technology up to 4 + N + 4, that is, we can add up to 4 pressed layers to a central core.