CIPSA GROUP

CIPSA GROUP

Carretera de Terrassa, 210 08191 RUBÍ Barcelona Spain

IMS Circuits

IMS Circuits

IMS CIRCUITS

Despite the relentless advancement in the efficiency of electronic components, such as processors, power semiconductors, converters, amplifiers and power LEDs, more and more heat energy has to be dissipated to meet the demands for higher system performance in smaller dimensions. diminishing physical For this reason, CIPSA offers IMS circuits , which are printed circuits with a metallic substrate that functions as a heat sink. The metal substrate can be Copper or Aluminum, they are generally used because they are materials with high thermal conductivity and allow the dissipation of the heat produced by the electronic components in the equipment in operation, although due to the cost the most commonly used are the Aluminum IMS . The thermal conductivity provided by Aluminum makes it possible to obtain a high density of components in the design, longer operating times of the equipment and greater safety against the possible failure of components, such as LEDs and high-power transistors.

Printed circuits with metal substrate (Isolated Metal Substrate) are usually single-sided with Aluminum material or double-sided with insulated and metallized hole (PTH). The most widely used use is in Led Technology, with a considerable increase in global demand, although they are also used in other sectors.

You can request Aluminum substrate printed circuits from us, both 1-sided and 2-sided, with thermal conductivity ranges of 1 W/mk, 1.3 W/mk, 1.8 W/mk, 2.2 W/mk and 3.2 W/mk.

Technical capabilities:

Aluminum Thickness 1.0mm, 1.2mm, 1.5mm, 2.0mmBase Copper 18 µm, 35 µm, 70 µm, 105 µmFinishes HAL Lead Free, Chemical Silver, OSPMinimum Conductor Width 18 microns copper 120 µmMinimum Conductor Separation 18 microns copper 120 µmMinimum Crown 180 µmMinimum metallic hole 0.3 mmMinimum insulating hole 1.0 mmMinimum non-metallic hole 0.6 mm

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