WILSONVILLE, Ore., Nov. 20, 2018 /PRNewswire/ -- Mentor, a Siemens business, today announced that DECA Technologies has become the latest member of Mentor's (outsourced assembly and test) OSAT Alliance - a program to help drive faster adoption of new, high-den Read more...
SEATTLE, Jan. 31, 2019 /PRNewswire/ -- Today, Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market. The new memory compiler boasts one of the highest density footprints in the industry dramatically reducing the die area and reducing customer product costs for sensors, smart locks, trackers and smart l Read more...
SAN JOSE, CA, March 14, 2019 /PRNewswire/ -- On March 14th at the OCP Global Summit, Inspur, a leading global data center infrastructure provider, and Intel, a leader in the semiconductor industry, jointly announced the plan to contribute a High-density Cloud-optimized platform to the OCP Community, code name "Crane Mountain". Thi Read more...
