If you are looking at mounting high performance devices, Ball Grid Array (BGA) assembly as it is popularly called, is your answer. A high-density PCB packaging technology, it is extensively used for Integrated Circuits (ICs). On account of its ability to offer high-density packaging with precision component placement, BGA is a popular Surface Mount Packaging that finds use in several electronic components where miniaturization is the order of the day.
At Technotronix, our extensive experience in BGA Assembly services is what has led to clients relying on us for their intricate designs. Irrespective of your size requirements, you can rest assured that we will be able to cater to your bespoke needs. Our robust testing methodologies ensure accuracy of the Ball Grid Array (BGA) Assembly. In addition, you can also count on us for extensive BGA Assembly rework.
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