T-M Vacuum Products, Inc

Endeavor 24™ Deposition System

Endeavor 24™ Deposition System

The Endeavor 24™ thin film deposition system is the latest release from T-M Vacuum Products in thin film technology, taking full advantage of today’s most advanced thin film deposition principals. The Endeavor 24™ is a universally dynamic tool, which can be configured to operate with either thermal evaporation or sputter deposition principles.

The Endeavor 24™ is a flexible vacuum system platform that can be ordered configured for magnetron/diode sputtering or electron beam/resistive evaporation depending on the user’s specific requirements. The Endeavor 24™ will accept a variety of deposition assist hardware including but not limited to an ion source, substrate rotation, thin film control, RF/DC Etch/ Bias, heat and gas partial pressure control.

Optional chamber sizes from as small as 18″ to as large as 48″ are available as a custom system design, enabling the Endeavor series to fit your specific film deposition and substrate geometry requirements.

General Features and Benefits of the Endeavor 24™ Thin Film Deposition System are:

• Compact foot print for better utilization of clean room space
• 304L Stainless Steel process chamber, pumping system and internal tooling
• Modular powder coated frame assembly with ease of access to all internal components
• T-M Intelligent™ HMI computer/process logic control system
• Low voltage control for safety and a noise free (EMF) environment
• Cryogenic or turbo-molecular high vacuum pumping capabilities
• Electro-polished process chamber, pumping system and internal tooling for better high speed pumping
• Accurate upstream/downstream gas control for more repeatable reactive film processing
• Automatic or manual Load Lock systems to reduce contamination and provide for a purer film environment
• Batch or single substrate capabilities designed to fit your requirement
• Flexible user friendly software tailored to meet your specific process needs

Thin Film features and benefits available with the Endeavor 24™ sputtering configuration are:

• Cathode positions with flexible orientation, up, down, side or angled, for uniformity and film growth control
• Cathode source shutter, and table shutter control
• Sequential and/or co-deposition materials development within a research or production environment
• Multiple as well as different types of power supplies RF, DC and DC-Pulsed, tailored to your film deposition requirements
• Optional Ion Source for ion etch, cleaning and IAD applications
• Concurrent dual side deposition for production applications
• Standard and optional substrate rotation systems for flat and three dimensional geometries
• Substrate heat up to 1100°C along with etch and bias for cleaner substrates and denser more homogenous films
• Upstream/downstream gas control for more repeatable reactive film processing
• Batch or single substrate capabilities designed to fit your requirement
• Flexible user friendly recipe management software tailored to meet your needs