Scheugenpflug Global

Heat Dissipation

RELIABLE HEAT MANAGEMENT

The rising power densities and high functional safety required for components such as chips, printed circuit boards or power electronics means they require effective heat management. 

The fluid thermal interface materials (TIM) used here offer numerous advantages compared to solid, stamped pads or films: Individual component contours are not a problem. In general, fluid materials also have a greater thermoconductivity. The preparation and dispensing of these highly filled, abrasive materials are no longer a challenge with our system solutions. 

Find the answer which aspects need to be taken into account when dispensing thermal interface materials in our new white paper.