Proaut

IT Testers

The IT Tester integrates the following three functions: testing, marking and packaging, in a single machine. The machine processes components in flip chip or SMD technology. The machine can be retooled according to the respective component type. The components are picked up from adhesive film or trays, positioned, measured, sorted, marked with a laser and packed in tapes.

Technical details

• The IT Tester offers 3 functions in one: testing – marking - packaging

• Components: flip chip, SMD, modules

• Smallest component size that can be processed: 1.4mm x 2mm

• Typical cycle time: ≤2s depending on the testing time

• Processing of 4”, 5”, 6”, 8” wafers and 12“ wafers (requires modifications)