PGF Technology Group

Assembly Methods

Assembly Methods

PCBs themselves consist of a copper layer sandwiched between a non-conductive substrate. The copper is etched into intricate electrical pathways, allowing current to move between components on the board. During the PCB assembly process, electrical components are added to this board using either surface or through-hole mounting.

Although the equipment, components, and mounting processes vary significantly between these two assembly methods, we have extensive experience in both techniques. Additionally, we often combine SMT and through-hole technologies for hybrid technology projects.

Surface Mounting

• uses surface mount technology (SMT) to mount components on top of the board
• the simplest way of installing electrical components
• makes it easier to utilize both sides of the board

Through-Hole Mounting

• uses a pre-drilled hole in the board through which a component can be inserted and soldered into place
• used for large components or any component otherwise incompatible with SMT