NEW ENGLAND DIE CUTTING

Phase-Change Thermal Pads

Phase-Change Thermal Pads

Phase-Change materials are heated into place during the assembly. These thermally conductive materials provide similar benefits to thermally conductive pads such as Sil Pad. Hi-Flow is a phase change material provided by Henkels’ Bergquist. Hi-Flow is useful in applications requiring a replacement for grease as a thermal interface between CPU or power devices and a heat sink. The benefits of Hi-Flow material include:

• A replacement to grease, with the benefit of saving time and money

As discussed with other thermal pads, replacing grease is a principle interest. This is because thermal grease can be difficult to apply properly, and difficult to clean up.

• Easy handling, not tacky at room temperature

Tackiness at room temperature can be difficult to handle. Having a neat, clean solution that is easy to apply to the application before the material activates can be very convenient.

A few Hi-Flow products include:

• Hi-Flow® 105, HF105 aka HI FLOW THF 900
• Hi-Flow® 225F-AC, HF225F-AC aka HI FLOW THF 1000F-AC
• Hi Flow® 225U, HF225U aka HI FLOW THF 1000U
• Hi-Flow® 650P, HF650P aka HI FLOW THF 1500P
• Hi-Flow® 625, HF625 aka HI FLOW THF 500

Hi-Flow® is available with or without pressure sensitive adhesive on the back. Thicknesses of different Hi-Flow® products range from .005” to .015”. NEDC die-cuts Hi-Flow® through conventional die-cutting equipment.