Metaplast Circuits

Technology Profile

Technology Profile

With the use of reverse pulse copper plating, and dual rectification DC copper plating, we realize superior plating distribution, which is necessary for very small holes and blind vias. We have produced up to 42 layers on 25” x 26” panel, with 15:1 aspect ratio in a .140” thick board.

Process capabilities include:

• Solder mask over bare copper
• Blind and buried vias
• Plated edges
• Heatsink fab and bond
• Line and space to .003” (.002″ possible)
• Mixed laminates & Hybrids
• Controlled Impedance
• PTFE, Teflon & Ceramic processing
• Conductive & Non-Conductive Hole Fill & Planarization
• Profile Milling & Side-Tapping