0.22mm Pitch and Greater • Accommodates Package Height Variations • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Contacts Connect Solder ball to Board Pad • Optional Heat Sink • Low Profile and Small Footprint • Zero-insertion-force • Surface Mount Design / Solder-Free
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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