Graphic plc

SBU

SBU

With the shrinking component footprints and increasing component densities demanded by today's technology, sequential build-ups are often the only solution for the PCB construction.

Graphic have many years experience of producing these types of construction, incorporating buried, blind and micro vias in a range of sub-assembly combinations.

We have also invested in both copper fill and resin processes, and these combined with our in-house IST testing ensure that the reliability of these constructions meets the demands of lead-free assembly and of our military and reliability dependent customers.

Some key features of SBU technology that we offer are:

• Standard micro via
• Copper filled micro via
• Stacked micro via (3 layers +)
• Resin filled buried and through vias
• Resin filled and copper capped buried and through vias