Electrovac Hacht und Huber GmbH

Transistor headers

Electrovac has over 60 years of know-how in transistor header production.

In the past, transistor packages or TO headers in standard dimensions were developed as a mass product to keep manufacturing costs as low as possible.

Depending on the glass seal technology, two different types of metal are used:

• As a compression glass feedthrough: cold-rolled steel with NiFe or kovar pins

• As a matched glass feedthrough: kovar or alloy 42 with kovar pins

The base plates or caps are fabricated in our own stamping facility using stamping or deep drawing technology.