Corintech Ltd.

Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small diameter soft metal wire is used to make the link and the bond is created by applying force and ultrasonic vibration.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities with gold wire bonding and aluminium wire bonding machines available on-site. Finished circuits are protected with epoxy encapsulation. The wire bonding process is extremely precise and delicate – the diameter of the wire can measure as little as 15µm which requires threading through a hole invisible to the naked eye.